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STMicroelectronics and Great Wall Motor establish joint development laboratory for new-generation automobiles

3 July 2013

STMicroelectronics, a leading global semiconductor provider and supplier of automotive electronics, and Great Wall Motor Company Limited (GWM), China’s leading SUV and pickup manufacturer and privately owned enterprise, have formed a strategic partnership and established a joint development laboratory at GWM’s Technical Center. The joint lab will focus on advanced research and development of advanced solutions in powertrain, chassis, safety, car body, car infotainment, as well as new-energy technologies and other automotive applications.

ST will contribute its newest automotive-electronics technologies and solutions including GDI (Gasoline Direct Injection) and BCM (Body Control Modules); automotive-class devices such as the PowerPC series 32-bit microcontrollers; highly integrated solutions for EMS (Engine Management System) and Safety (Passive and Active); complete platforms for Infotainment (Audio, Video, Connectivity and Navigation); reference designs; development tools; technical support and trainings for many different automotive applications.

The automotive electronics market is seeing rapid growth. Confronted with unprecedented competitive pressure, local automotive companies must implement strategic transformation and develop their own core technologies to compete with joint-venture brands.

With consumers paying more attention to safety and comfort in the car, those are among the areas in which we can add great value. The establishment of a joint laboratory with ST will play a very important role in helping GWM to enhance our core competences in automotive electronics and it will build a solid foundation for deep cooperation of both parties in the future.

—Huang Yong, Senior Vice President and Chief Director of Technical Center, Great Wall Motor

July 3, 2013 in Brief | Permalink | Comments (1) | TrackBack (0)

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Comments

Very positive JV with excellent potential to introduce high efficiency electronics into low efficiency ICEVs, and to further increase the efficiency of HEVs, PHEVs and BEVs.

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