Mitsubishi Electric Corporation has introduced a new transfer molded power module (T-PM) mainly designed for hybrid and electric vehicle applications. The company’s J Series T-PM, whose lifespan is 30 times longer than that of industrial power modules and is completely lead-free, provides enhanced reliability by incorporating Mitsubishi Electric’s proprietary technology that ensures power loss reduction. Sales will begin 8 April 2011.
Two carrier-stored trench gate bipolar transistor (CSTBT) IGBT chips are incorporated in a 600V/300A power module.
Mitsubishi Electric’s J-Series T-PM offers enhanced reliability by incorporating the company’s original, inner connection technology called direct lead bonding (DLB). DLB reduces power loss through decreasing wiring resistance and inductance in modules by way of an extended main terminal that is sufficiently long to be bonded directly to the power chip. Power chips were previously connected to terminals by aluminum wire.
In 2004, Mitsubishi Electric became the first company in the industry to launch a highly reliable, lead (Pb)-free power module for automotive applications by using transfer molding technology. Transfer molding is a pressure molding method by which heated and pressurized resin is poured into a metal mold and enclosed. This method enables manufacturers to make multiple molds simultaneously and render power modules highly reliable.