Fuji Electric Co., Ltd., and the chip manufacturer Infineon Technologies AG have agreed on a joint common footprint for automotive IGBT power modules using the Infineon HybridPACK 2 power module, thereby establishing a dual-source supplier base for power modules deployed in automotive hybrid and electrical vehicles (HEV).
In response to the need for supply security for HEV power modules, Infineon and Fuji agreed on the size of the module, the position of pin-outs, the use of the pin-finned copper base plate and on other mechanical features. The agreement comprises the HybridPACK 2 module, the FS800R07A2E3 featuring 650V/800A.
Infineon developed its power modules HybridPACK 2 for direct liquid-cooled systems as common in hybrid vehicles and electrical vehicles. The HybridPACK 2 modules offer the industry’s smallest footprint at the given high power density, according to the company—approximately 20% smaller than other modules on the market.
Today’s electronic control systems for full hybrid cars and electrical vehicles can equal the size of two standard shoe boxes, weighing an average of 30 kg. A system with HybridPACK 2 power module technology is only about a third the size and weighs approximately 20 kg compared to other state-of-the-art solutions. The pin-finned copper base plate in HybridPACK 2 not only enhances thermal performance, but also increases reliability.
The HybridPACK 2 modules of Infineon are available in high-volume. Fuji plans to have power modules with HybridPACK 2 footprint available as of 2013.