NXP introduces second car-to-X RoadLINK product
12 June 2014
NXP Semiconductors N.V. announced that the TEF510x, the second product from the RoadLINK range (earlier post), is now available to automotive Original Equipment Manufacturers (OEMs) and Tier 1 suppliers for design-in. The TEF510x is a dual radio multi band RF transceiver for Car-to-X (C2X) applications. Supporting global C2X and Wi-Fi standards, the TEF510x provides OEMs with an optimized solution to meet 802.11p modem functionality on one chip. The chip has the flexibility to support global deployments and various system configurations.
The TEF510x RF transceiver meets Japanese 760Mz C2X requirements, US and European (5.9GHz) as well as Wi-Fi and DSRC (5.8GHz) specifications. It will be released for automotive production in 2015 and is expected to be available to consumers as early as 2016.
Together with the NXP/Cohda Wireless SAF510x baseband processor, powered by software defined radio technology, the RoadLINK chip provides fast, accurate and reliable communication to and from the vehicle.
Japanese-based company ALPS Electric is already using products from NXP’s RoadLINK range to deliver in-car applications.
Key Features of the new TEF510x solution are:
RF-Transceiver for global C2X standards, covering Europe, US and Japan, as well as DSRC and Wi-Fi (802.11abgn) standards;
Support for various antenna configurations and diversity schemes;
Together with SAF510x enabling Best-in-class 802.11p reception performance and communication range for mobility use cases even in non-line-of-sight conditions; and
AEC-Q100 qualification scheduled for 2015