The fabrication process which we licensed to Lintec, retains CNTs’ extraordinary properties, generating endless possibilities for high value applications. Examples include structural composites for aerospace and automobile sectors, flexible electronics, chem/biosensors, transparent conductive films, organic light emitting diodes, energy harvesting and storage, smart nano adhesives, battlefield dressings, EMI shielding, and others. Recent research demonstrates promise for an expanding range of applications, from aerial and underwater sound projectors, to lightweight biocompatible materials for biomedical solutions.

—Ray Baughman

DryDraw is an advanced solid state fabrication process, which produces cSilk, a versatile range of CNT macrostructures, including sheets, tapes and yarns. This unique dry state self-assembly process employs proprietary CNT forests with optimized morphological characteristics, taking into account preferential alignment of CNTs, their interbuilding, and interaction with the substrate used for growth.

150µm cSilk sheet pulled from a 50µm substrate. Source: Lintec. Click to enlarge.

Unlike traditional processing methods involving liquids/powders, DryDraw retains the extraordinary properties of individual CNTs, delivering superior alignment, density control and transferability, without limitations on sheet width or length. The fast, continuous and highly reproducible process eliminates issues such as liquid dispersion and compatibility with matrix materials, Lintec says.

cSilk CNT sheets are transparent, flexible, thin, pure, and lighter than air. Highly anisotropic and multifunctional, cSilk sheets can be twisted into yarns, kept freestanding, or transferred onto a substrate.

Novel multifunctional materials and composites can be created, utilizing cSilk as a substrate for depositing a multitude of otherwise difficult to process micro and nanoparticles.

As a substrate, cSilk can contain up to 99 wt. % of guest materials. It can also be used as a pouch to accept other powder-like materials.