Dow Corning and Delphi received the award for Dow Corning EA-7100 Adhesive, a product initially developed for Delphi, which was grappling with several adhesion challenges.

The adhesive is based on novel silicone chemistry that significantly expands design options for automotive electronics and other applications by enabling strong bonds to a wide variety of substrates. This one-part, heat-cure adhesive also cures rapidly and at lower temperatures from the “inside out” to greatly accelerate processing, lower energy use and reduce material costs.

The EA-7100 Adhesive forms strong bonds to metals, ceramics, glass and laminates, as well as plastics that have typically presented challenges for conventional silicone, such as polyethylene, polycarbonate and acetal. Depending on application, the material can often bond to these substrates without requiring pre-treatment or extensive cleaning. This unique property, combined with the material’s low voiding and durable adhesion, enables automotive manufacturers to design components using an expanded range of more cost-effective materials.

Formulated with patented new silicone chemistry, Dow Corning EA-7100 Adhesive offers more options for designing next-generation electronics including control units, sensors, lighting and display modules, and provides advantages such as greatly accelerated processing speed, and reduced energy use.