ON Semiconductor has launched new Automotive Intelligent Power Modules (IPMs) that offer class-leading power density and improve overall performance in on-board charging (OBC) and other high-voltage DC-DC conversion applications for electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs).
The FAM65xxxx APM16-packaged devices offer a fully-featured, integrated solution that eases design-in for automotive customers with one device outline covering H-Bridge, PFC and bridge rectifier configurations to address applications at each OBC and DC-DC stage.
FAM65xxxx modules address a rapidly growing market as the number of EV and PHEV vehicle designs and production volumes increase. They can save approximately 50% board space and significantly ease manufacturability versus discrete component based solutions. Their small size and weight combined with high efficiency levels can dramatically improve power density and system efficiency, contributing to reduced fuel consumption and CO2 emissions for vehicles.
ON Semiconductor’s new IPMs also offer improved reliability versus discrete solutions and other power modules, due to optimized content and internal layout resulting in excellent thermal performance. Moreover, lower electromagnetic interference (EMI) has been reached due to an integrated high voltage capacitor.
The devices have an internal direct bonded copper (DBC) structure that is fully isolated to 5 kilovolts AC / second, making them easier to use by alleviating the need for insulation sheets associated with discrete solutions. Safety and reliability is further underlined with compliance to the latest, most stringent automotive qualifications—AECQ 101 and AQG324.