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Synopsys and GLOBALFOUNDRIES to develop industry’s first automotive grade 1 IP for 22FDX process; ADAS, powertrain, 5G, and radar automotive SoCs

Synopsys, Inc. and GLOBALFOUNDRIES (GF) will collaborate to develop a portfolio of automotive Grade 1 temperature (-40 ˚C to +150 ˚C junction) DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator (22FDX) process. By providing IP that is designed for high temperature operation on 22FDX, Synopsys enables designers to reduce their design effort and accelerate AEC-Q100 qualification of system-on-chips (SoCs) for automotive applications such as eMobility, 5G connectivity, advanced driver assistance systems (ADAS), and infotainment.

The Synopsys DesignWare IP implements additional automotive design rules for the GF 22FDX process to meet stringent reliability and operation requirements. This latest collaboration complements Synopsys’ broad portfolio of automotive-grade IP that provides ISO 26262 ASIL B Ready or ASIL D Ready certification, AEC-Q100 testing, and quality management.

Arbe’s ultra-high-resolution radar is leveraging this cutting edge technology that enabled us to create a unique radar solution and provide the missing link for autonomous vehicles and safe driver assistance. We need to work with leading companies who can support our technology innovation. GF’s 22FDX technology, with Synopsys automotive-grade DesignWare IP, will help us meet automotive reliability and operation requirements and is critical to our success.

—Avi Bauer, vice president of R&D at Arbe

On 25 February, Synopsys will join the GLOBALFOUNDRIES NEXTech Lab Theater Session at MWC19in Barcelona. A panel discussion, with leading industry experts, including Joachim Kunkel, general manager of the Solutions Group at Synopsys, and Mike Cadigan, senior vice president of global sales, business development, customer and design engineering at GF, will offer insights about the importance of intelligent connectivity, the growth, demands, and innovations it is poised to bring, and its impacts across the semiconductor value chain.

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