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DENSO, Toyota in-vehicle semiconductor JV to be named MIRISE; focus on EVs and AVs

DENSO Corporation and Toyota Motor Corporation have named their joint venture to be established in April 2020 MIRISE Technologies (earlier post). The joint venture will conduct research and advanced development of next-generation in-vehicle semiconductors. MIRISE is an acronym for Mobility Innovative Research Institute for SEmiconductors.

It also conveys “mirai” (a Japanese word for “future”) and “rise.” Yoshifumi Kato has been appointed President and Representative Director of the new company.

MIRISE will accelerate the development of next-generation in-vehicle semiconductors that play a key role in technology innovation for electric vehicles and automated driving vehicles from aspects of both vehicles and components by combining Toyota’s knowledge on mobility with DENSO’s knowledge on in-vehicle components.

MIRISE will work on three technology development fields:

  • Power electronics. In the power electronics field, the company will work on R&D mainly for in-house production (including contract manufacturing) by leveraging the semiconductor material technologies as well as manufacturing and design technologies accumulated by Toyota and DENSO in electrification technologies, mainly in hybrid vehicles.

  • Sensing. In the sensing field, the company will work on development for in-house production and cooperation with joint development partners.

  • SoC (System-on-a-Chip). In the SoC field, the company will strengthen its ability to determine the specifications of optimal SoCs for mobility in the future.

To achieve the above goals based on a speedy and competitive system, MIRISE will start negotiations on cooperation with universities, research institutes, start-ups, and semiconductor-related companies. The recruitment of semiconductor engineers will also be strengthened.

MIRISE Technologies will be owned 51% by DENSO, 49% by Toyota.


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