DENSO has established the DENSO Mobility Collaborative Research Center jointly with Tokyo Institute of Technology (Tokyo Tech) under the university’s industry liaison program. The Collaborative Research Cluster will promote joint research with the support of Tokyo Tech’s Open Innovation Platform from research planning to commercialization.

So far, DENSO and Tokyo Tech have conducted joint research and produced results in many fields including thermal management technology and packaging technology for in-vehicle computers. For the age of CASE (connected, automated, shared, and electric) vehicles, DENSO and Tokyo Tech have signed an organizational partnership agreement to accelerate their joint research, and will make coordinated efforts to conduct comprehensive research in a wide range of fields at the Collaborative Research Cluster.

Specifically, the Collaborative Research Cluster will have, on the Ookayama campus of Tokyo Tech, a dedicated space to conduct applied research on heat dissipation technology for automotive components, as well as explore themes in new research together with researchers in different fields of specialization including electronics, semiconductors, electricity, mechanics, and communication to promote joint research with them.