Hyliion and Tortoise Acquisition to merge, combined company to remain listed on NYSE
Strategy Analytics forecasts strong growth in automotive sensors driven by EV demand

Danfoss enters multi-year volume agreement with Infineon for electro-mobility power semiconductors

In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.


With electro-mobility, the semiconductor content per car will increase to almost double that of conventional cars. Power semiconductors represent by far the largest part of this additional content. The expansion of our manufacturing capacities, for example in Villach, Austria, enables us to establish a long-term cooperation with customers like Danfoss. A reliable and resilient supply chain is crucial for the rapid success of the mobility revolution.

—Peter Schiefer, President of the Automotive Division at Infineon

Infineon produces the IGBTs and diodes for Danfoss at its plants in Dresden, Germany, and Villach, Austria. Danfoss manufactures its power modules in Flensburg, Germany, and Utica, New York.


The comments to this entry are closed.