New SEMI Auto IC Master to support collaboration between Taiwan chipmakers and automotive ecosystem
12 July 2022
SEMI Taiwan launched the SEMI Auto IC Master, a comprehensive guide to automotive semiconductor and component providers in Taiwan. Designed to enable closer collaboration among carmakers, automobile Tier 1 suppliers and Taiwan’s semiconductor IDM and fabless companies, the guide promises to help automakers better adapt production capacity to semiconductor supply chain disruptions and drive innovation.
The guide is available through an online account or in hard copy and can be purchased by contacting the SEMI Taiwan representatives listed on the SEMI Auto IC Master webpage.
The ongoing chip shortage underscores the need for SEMI member companies and the automotive supply chain to collaborate more closely to help maintain adequate chip supplies for automakers during supply chain disruptions. The SEMI Auto IC Master helps lay the groundwork for automotive innovations in the coming decade and beyond.
—Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan
Automotive semiconductors are expected to record a compound annual growth rate (CAGR) of 16.5% through 2026, while electronic components spending for electric vehicles, self-driving cars, advanced driver assistance systems (ADAS) and other in-vehicle products is expected to increase 50% by 2030, according to market research firm Gartner.
Taiwan’s chip manufacturing efficiency holds the key to enabling greater efficiencies between automakers and the semiconductor supply chain. Electric vehicle market growth is a key driver of semiconductor demand in the automotive sector, with the number of chips in an EV expected to exceed 3,000 in the future. I encourage additonal Taiwanese semiconductor companies to work more closely with the automotive sector to help drive the expansion of this important market.
—John Hsuan, Honorary Vice Chairman of United Microelectronics Corp. (UMC)
They need alternate sources besides Taiwan
Posted by: SJC | 13 July 2022 at 07:25 AM