Toyota Research Institute unveils new generative AI technique for vehicle design
Airbus and STMicroelectronics collaborate on SiC and GaN power electronics for aircraft electrification

Stellantis and Foxconn form SiliconAuto JV to design and sell semiconductors for automotive industry

Stellantis N.V. and Hon Hai Technology Group (Foxconn) announced the creation of SiliconAuto, a 50/50 joint venture dedicated to designing and selling a family of state-of-the-art semiconductors to supply the automotive industry, including Stellantis, starting in 2026.

The joint venture is the product of a December 2021 agreement between Stellantis and Foxconn to develop a family of semiconductors for automotive applications. (Earlier post.)

The joint venture combines Foxconn’s development capabilities and domain expertise in the ICT industry with Stellantis’ deep understanding of diverse mobility needs around the world. SiliconAuto will provide customers an auto industry-centric source of semiconductors for the growing number of computer-controlled features and modules, particularly those needed for electric vehicles.

Products from SiliconAuto will support the future semiconductor needs of Stellantis, Foxconn and other customers. This includes STLA Brain, Stellantis’ new electrical/electronic and software architecture with full over-the-air updating capabilities.

SiliconAuto will be headquartered in the Netherlands. The management team includes executives from both founding partners. Stellantis will provide input to SiliconAuto to enable and deliver capabilities needed by future battery-electric vehicles and multi-energy vehicle platforms.

In addition to SiliconAuto, Stellantis and Foxconn formed the Mobile Drive joint venture focused on developing smart cockpits enabled by consumer electronics, human-machine interfaces and services.

Comments

The comments to this entry are closed.