Point2 Tech secures $22.6M Series B extension from Bosch Ventures and Molex; E-Tube multi-terabit interconnect for AI and automotive
16 February 2024
Point2 Technology, a provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, announced a $22.6-million Series B extension from Bosch Ventures and Molex, a global electronics leader and connectivity innovator, with participation from other investors.
The boost in funding comes at a time when the use of AI in data centers is skyrocketing. According to a January 2024 report from Dell’Oro Group, the surge in AI infrastructure investment is expected to drive up data center capital expenditure (capex) by 15 percent, reaching $500 billion by 2027. This capex spike is driven largely by AI infrastructure investment. A key element of this growth is the anticipated 50% surge in the data center switch market, where the integration of Point2 interconnect chips is set to revolutionize connectivity. This advancement is expected to escalate the demand for interconnect silicon by 50%, underscoring AI’s pivotal role in redefining data center technology’s future.
Point2 is also partnering with Molex to commercialize its E-Tube technology, a scalable interconnect platform that uses RF data transmission over plastic dielectric waveguide to enable multi-terabit active cables with 80% lower weight and 50% less bulk than copper cables.
Compared to optical cables, E-Tube is expected to reduce power consumption and costs by 50%, with picosecond latencies that are three orders of magnitude better. Shattering the “copper or optics” paradigm for high-speed cable interconnect, E-Tube breaks the barriers of copper and optical cabling and is seeking to become the next-generation multi-terabit interconnect technology.
Illustration of E-Tube links and comparison with electrical and optical links. (a) E-Tube links including metal-clad dielectric waveguides referred to as E-Tube, the Microstrip-to-Waveguide Transitions on the board, the waveguide-to-board connectors, and RF transmitter/receiver ICs for board-to-board multi-channel communication and (b) comparison of maximum transferable data rate of copper, optical, and E-Tube links. The comparison is based on the general usage of each link. Song et al.
We are thrilled to have support from Bosch, a Tier 1 supplier in the automotive industry, and from Molex as we advance our mission to revolutionize interconnect technology in AI/ML data centers and next-generation automotive applications. Our collaboration with Bosch underlines the importance and high potential of Point2’s low-power, low-latency, scalable interconnect technologies in the expansive automotive sector and further amplifies our impact in connecting AI workloads for the growing data center market.
—Sean Park, Point2’s Founder and CEO
Resources
Song, H.I., Lee, JY., Won, H. et al. (2020) “E-TUBE: dielectric waveguide cable for high-speed communication.” Sci Rep 10, 18263 doi: 10.1038/s41598-020-75363-4 (open access)
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