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ENNOVI introduces automotive-grade stackable multi-row board-to-board connector platform that snaps together without solder

ENNOVI, a mobility electrification solutions partner, has introduced the new ENNOVI-MB2B multi-row board-to-board (BTB) connector platform featuring a proprietary snap-in biscuit design, allowing multiple connector units to be stacked together without solder.


This cost-effective approach enables different pin count requirements to be accommodated via the same basic interconnect platform, without any extra expense or engineering effort.

The new multi-row BTB connectors feature ENNOVI’s patented 0.4mm miniPLX press-fit terminals made from a copper alloy that exhibits very low levels of contact resistance (<1mΩ). Each pin has a 3A current carrying capability. The optional coating of these pins with the company’s patented IndiCoat plating technology mitigates tin whisker build-up, this preventing the risk of short circuits and extending operational lifespan.


ENNOVI-MB2B connectors are available in board stacking heights from 7mm to 30mm. They can have between 1 and 6 rows, with up to 30 contact terminals being incorporated into each row. Conforming with automotive performance requirements, these products can withstand high humidity levels (8 hour cycling up to 10% RH), mechanical shock (35g for 5 to 10ms across 10 axes) and vibration (8 hour per axis). A working temperature range of -40 °C to +150 °C is supported.

The robust, high-density, scalable multi-row BTB connectors will be targeted at a broad variety of applications. Among the most prominent of these are going to be electric vehicles (EVs), particularly for Electric Power Steering (EPS) and Electronic Control Unit (ECU) functions.


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