At its debut at Auto Shanghai, Intel unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), the automotive industry’s first multi-process node chiplet architecture. Engineered to meet the growing demands of intelligent, connected vehicles, the new SoC provides automakers scalable performance, advanced AI capabilities and optimized cost efficiency.

Intel also announced new strategic collaborations with automotive innovators ModelBest and Black Sesame Technologies, further expanding Intel’s automotive ecosystem and accelerating innovation in AI-powered cockpits, integrated advanced driver-assistance systems (ADAS) solutions and energy-efficient vehicle compute platforms.

The second-generation Intel SDV SoC is the automotive industry’s first to leverage a multi-node chiplet architecture, enabling automakers to tailor compute, graphics and AI capabilities to their needs, while reducing development costs and accelerating time-to-market. By combining best-in-class silicon for each functional block, the architecture offers:

• Up to 10x AI performance for generative and multimodal AI.

• Up to 3x graphics performance for richer human-machine interface (HMI) experiences.

• 12 camera lanes for increased camera input and image processing capabilities.