Micron plans to invest ~$200B in semiconductor manufacturing and R&D in Idaho, New York and Virginia
13 June 2025
Micron Technology and the Trump Administration announced Micron’s plans to expand its US investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, creating an estimated 90,000 direct and indirect jobs.
As part of the announcement, Micron plans to invest an additional $30 billion beyond prior plans which includes building a second leading-edge memory fab in Boise, Idaho; expanding and modernizing its existing manufacturing facility in Manassas, Virginia; and bringing advanced packaging capabilities to the US to enable long-term growth in High Bandwidth Memory (HBM), which is essential to the AI market.
Additionally, Micron is announcing a planned $50-billion domestic R&D investment, reaffirming its long-term position as the global memory technology leader. As previously announced, Micron’s investment includes its ongoing plans for a megafab in New York.
Micron’s approximately $200-billion broader US expansion vision includes two leading-edge high-volume fabs in Idaho, up to four leading-edge high-volume fabs in New York, the expansion and modernization of its existing manufacturing fab in Virginia, advanced HBM packaging capabilities and R&D to drive American innovation and technology leadership. These investments are designed to allow Micron to meet expected market demand, maintain share and support Micron’s goal of producing 40% of its DRAM in the US. The co-location of these two Idaho fabs with Micron’s Idaho R&D operations will drive economies of scale and faster time to market for leading-edge products, including HBM.
Micron has already achieved key construction milestones on its first Idaho fab with DRAM output scheduled to begin in 2027. The second Idaho fab will increase Micron’s production of DRAM in the US, serving growing market demand fueled by AI, while the company expects to begin ground preparation in New York later this year following completion of state and federal environmental review processes. Micron expects its second Idaho fab to come online before the first New York fab. Micron will continue to manage its supply growth consistent with market conditions.
Following the completion of the second Idaho fab, Micron plans to bring advanced HBM packaging capabilities to the US. Additionally, Micron has finalized a $275-million CHIPS Act direct funding award supporting its investment to expand and modernize its Manassas, Virginia facility, which will begin this year. This investment will onshore Micron’s 1-alpha DRAM node, reinforcing the company’s ongoing commitment to key sectors including industrial, automotive, defense and aerospace, and medical devices.
Micron anticipates that all of its US investments will be eligible for the Advanced Manufacturing Investment Credit (AMIC), and the company has already secured support at the local, state and federal level. This includes up to $6.4 billion in CHIPS Act direct funding to support the construction of two Idaho fabs and two New York fabs, as well as the expansion and modernization of its Virginia fab. Micron applauds Rep. Tenney (R-NY) for introducing the Building Advanced Semiconductors Investment Credit Act, which would increase AMIC to 35% and extend it by four years. Strengthening AMIC will help ensure investment in U.S. semiconductor manufacturing over the next four years and support long-term growth, reestablishing America’s leadership in this critical industry.
To support the growth of the US semiconductor industry, Micron has committed more than $325 million to develop the next-generation workforce and strengthen communities across Idaho, New York and Virginia. This investment includes semiconductor curriculum development, community college partnerships for apprenticeships, university partnerships and other programs aimed at expanding access to semiconductor careers.
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