Germany-based Wevo has introduced WEVOSIL 22106 FL, 22102 FL and 22105 FL—three new potting compounds from Wevo which offer excellent protection against mechanical stresses due to their supersoft consistency. These three materials also enable efficient thermal management and are optimized for reliable potting.

They provide solutions for use in numerous modern electronic components, including wire bonds and inductive components such as chokes or transformers, either with or without ferrite cores.

The Wevo products are suited for advanced electrical components requiring high mechanical stability, thermal conductivity and heat resistance. Among other things, the potting compounds are driving technological progress in modern circuits, EMI/Pi filters and PFC circuits as well as in ECUs for trains and electric vehicles.

The potting compounds in the WEVOSIL 2210x series have been specifically optimised to ensure reliable silicone encapsulation.

With a hardness of around 60 Shore 00, the electro casting resins in Wevo’s WEVOSIL 2210x series have a supersoft consistency when cured. The result: excellent damping of stresses such as vibration or shocks. Due to their modern fillers, these three potting compounds also combine all the advantages of thermally conductive silicones, including very good basic adhesion and elongation at break of more than 100%.

The three WEVOSIL types have different levels of thermal conductivity, meaning users can select the right solution depending on specific customer and component requirements:

• WEVOSIL 22106 FL: Thermal conductivity: 0.5 W/m-K, density: 1.38 g/cm³ – when heat dissipation is a must but the focus is on low material density as a way to save weight.

• WEVOSIL 22102 FL: Thermal conductivity: 1.0 W/m-K, density: 1.68 g/cm³ – when good heat dissipation is needed.

• WEVOSIL 22105 FL: Thermal conductivity: 1.5 W/m-K, density: 2.61 g/cm³ – when the application calls for both high temperature resistance and above-average heat dissipation.

In addition to their heat-dissipating function, all three variants meet the requirements for classic heat-resistant silicones. The long-term temperature resistance is 180 °C to 200 °C, depending on the type – a key criterion for use with thermally demanding electronic components.

With their high flowability, these silicone potting compounds ensure reliable and efficient potting of electronic components. All WEVOSIL 2210x grades feature a standard viscosity < 5,000 mPa·s, making the materials ideal for precise, bubble-free potting of small cavities or components with complex geometries.