Toshiba Electronic Devices & Storage Corporation announced that Zhejiang Asia-Pacific Mechanical & Electronic Co. Ltd. (APG), one of China’s leading manufacturers of vehicle braking systems, will deploy the Visconti 4 image-recognition processor in its next-generation advanced driver assistance system (ADAS). This marks the first time that a Visconti family processor... Read more →

ams, a leading worldwide supplier of high performance sensor solutions, and Ibeo Automotive Systems GmbH, the German specialist and a global technology supplier for automotive LiDAR sensor technology and the associated software, confirmed that ams Vertical Cavity Surface Emitting Laser (VCSEL) technology is a core component of Ibeo’s newly-developed solid-state... Read more →

Lucid Motors announced DreamDrive, its new advanced driver-assistance system (ADAS). The platform combines what Lucid calls the most comprehensive sensor suite on the market with an advanced driver monitoring system, all standard on the first versions of the Lucid Air EV, scheduled for delivery in early 2021. The DreamDrive technology... Read more →

Effective January 2021, Toyota Research Institute - Advanced Development, Inc. will expand and improve its operations into a holding company and two operating companies. The holding company will be Woven Planet Holdings, Inc. and the two operating companies under it will be Woven CORE, Inc., which will develop, implement and... Read more →

The market for software-intensive automotive electronic systems is expected to grow by some 15% annually between now and 2030. Bosch is now establishing a new division, Cross-Domain Computing Solutions. From the start of 2021, existing and new customers will receive electronics systems and the requisite software from a single source:... Read more →

Continental has adopted Renesas Electronics Corporation’s high-performance Renesas R-Car M3 System-on-Chip (SoC) for its first-generation Body High-Performance Computer (HPC). The HPC is an automotive computing platform that provides centralized control of vehicle systems and is equipped with secure gateway functionality to enable cloud service connectivity. The R-Car M3 supports over-the-air... Read more →

Addressing the ongoing migration towards autonomous driving, Toshiba has introduced a high-resolution, long-range light-receiving technology for deployment in solid-state LiDAR systems. By removing the need for bulky mechanical components, the technology realizes cost and space savings and enhances operational reliability. At its heart is Toshiba’s proprietary compact, high-efficiency silicon photo-multiplier... Read more →

Using radar commonly deployed to track speeders and fastballs, researchers have developed an automated system that will allow cars to peer around corners and spot oncoming traffic and pedestrians. Researchers combined artificial intelligence and radar used to track speeders to develop a system that will allow vehicles to spot hazards... Read more →

Three UC Riverside engineers have received a $1.2-million grant from the National Science Foundation to develop a new generation of energy-efficient, energy-elastic, and real-time-aware GPUs suitable for use in resource-constrained environments such as emerging embedded and autonomous systems, including aerial drones and autonomous vehicles. The three Marlan and Rosemary Bourns... Read more →

Mercedes-Benz and NVIDIA plan to enter into a cooperation to create a new in-vehicle computing system and AI computing infrastructure. Starting in 2024, this will be rolled out across the fleet of next-generation Mercedes-Benz vehicles, enabling them with upgradable automated driving functions. The new software-defined architecture will be built on... Read more →

Phantom AI Inc., a developer of a vehicle-agnostic autonomous driving platform, announced the joint development with Renesas Electronics Corporation of full stack Level 2 advanced driver assistance system (ADAS) solutions. Phantom AI offers a flexible, automotive-grade ADAS solution on Renesas’ single, low-power R-Car V3H system-on-chip (SoC), which provides enough computing... Read more →

Henkel introduced Bergquist Gap Filler TGF 7000, its latest thermal interface material (TIM) innovation. The liquid TIM is a major formulation breakthrough, as it effectively marries high thermal conductivity of 7.0 W/mK with a maximum possible speed tested of 18 grams per second, a combination which is currently the only... Read more →

ams, a global supplier of high performance sensor solutions, introduced the AS5715: the first inductive position sensor for high-speed, automotive and industrial electric motors to be available as a standard product on the open market. New rotor position sensing solutions based on the AS5715 can match the accuracy and latency... Read more →

ON Semiconductor has released the first two devices from its new VE-Trac family of power modules for high voltage automotive traction inverters. These two power integrated module (PIM) devices bring best-in-class electrical and thermal performance while providing scalability and automotive reliability to the rapidly growing market for traction inverters. Future... Read more →

DENSO Corporation and Toyota Motor Corporation have named their joint venture to be established in April 2020 MIRISE Technologies (earlier post). The joint venture will conduct research and advanced development of next-generation in-vehicle semiconductors. MIRISE is an acronym for Mobility Innovative Research Institute for SEmiconductors. It also conveys “mirai” (a... Read more →

A group of leading automotive and technology industry companies including Arm, Bosch, Continental, DENSO, General Motors, NVIDIA, NXP Semiconductors and Toyota have joined forces to help accelerate the delivery of safer and affordable autonomous vehicles at scale with the formation of the Autonomous Vehicle Computing Consortium (AVCC). AVCC commits to... Read more →

DENSO Corporation and BlackBerry Limite announced the first integrated HMI (Human Machine Interface) digital cockpit system with BlackBerry QNX technology has shipped in the first vehicles by Japanese automotive manufacturer, Subaru. The technology, named DENSO ‘Harmony Core’ will be available first in the United States from Autumn 2019 in the... Read more →

DENSO Corporation and Toyota Motor Corporation will establish a joint venture for research and advanced development of next-generation, in-vehicle semiconductors. The two companies will study the details and aim to establish the new company in April 2020. Recently, electronic controls have been increasingly implemented into vehicles. Furthermore, the number of... Read more →

Renesas Electronics Corporation has developed a new flash memory technology that achieves larger memory capacities, higher readout speeds, and over-the-air (OTA) support for automotive microcontrollers (MCUs) using the next-generation 28nm process. This new technology achieves the industry’s largest capacity of embedded flash memory on an MCU – 24 MB –... Read more →

Infineon’s planned $10-billion acquisition of Cypress Semiconductor will produce the world’s largest automotive chip supplier, surpassing current market leader NXP and giving the German firm a stronger position in the critical markets for infotainment and advanced driver assist systems (ADAS), according to IHS Markit. In 2018, Infineon ranked second in... Read more →

Renesas Electronics Corporation continues to accelerate the development of advanced driver assistance systems (ADAS) systems with new Perception Quick Start Software based on its R-Car V3H system-on-chip (SoC). The solution delivers reference software for camera obstacle detection (COD), LiDAR obstacle detection (LOD), and road feature detection (RFD)—three key recognition areas... Read more →

Electronic control units (ECUs) are playing an increasingly critical role in the automotive industry, driving the development of safer, smarter, cleaner and better-connected cars. As a result, IHS Markit expects global automotive ECU revenue to soar to $211 billion in 2030, rising at a compound annual growth rate (CAGR) of... Read more →

ZF announced ZF coPILOT, an intelligent advanced driver assistance system (ADAS) leading to enhanced safety and driving comfort opportunities. Leveraging the power of AI and equipped with a comprehensive sensor set, vehicles can perform various automated driving functions, especially on freeways. In addition, ZF coPILOT can be operated with voice... Read more →

At its GPU Technology Conference, NVIDIA announced NVIDIA DRIVE AP2X—a complete Level 2+ automated driving solution encompassing DRIVE AutoPilot software, DRIVE AGX and DRIVE validation tools. DRIVE AP2X incorporates DRIVE AV autonomous driving software and DRIVE IX intelligent cockpit experience. Each runs on the high-performance, energy-efficient NVIDIA Xavier system-on-a-chip (SoC)... Read more →

Renesas Electronics Corporation announced the first microcontroller (MCU) with embedded flash that integrates a hardware-based virtualization-assisted function while maintaining the fast, real-time performance of the RH850 products. This hardware-based virtualization assist technology can support up to ASIL D level of functional safety, providing greater levels of system integration. The RH850/U2A... Read more →

Cars have been evolving with increasingly complex circuitry. SEAT’s Ateca crossover (SEAT is a Volkswagen Group company, the Ateca is based on the MQB platform and is related to Volkswagen’s Tiguan) features a complex arrangement of wires more than 2.2 km long. The wires, ranging from one millimeter to one... Read more →

Renesas Electronics Corporation announced the development and successful operation verification of an automotive test chip as a technological stepping stone toward the realization of next-generation automotive-control flash Microcontrollers (MCUs) employing a 28 nanometer (nm) low-power process. The MCU features four 600 megahertz (MHz) CPUs with a lock-step mechanism and a... Read more →

NSITEXE, Inc., a DENSO Group company that designs and develops semiconductor IP cores, acted as lead investor and has a stake in startup quadric.io. The purpose of the investment is to help quadric.io’s development of edge processing units (EPUs)—high-performance semiconductors that could be used as a foundation for enabling automated... Read more →

At CES 2019, ZF will unveil a steering-wheel- and pedal-free robo-taxi to show how its technologies enable new forms of urban mobility. Users can hail the taxi using their smartphone or tablet; the robo-taxi will maneuver autonomously to pick them up. It can then chauffeur them to where they wish... Read more →

Infineon Technologies AG is the first semiconductor manufacturer to put a Trusted Platform Module (TPM) specifically for automotive applications on the market. The new OPTIGA TPM 2.0 protects communication between the car manufacturer and the car—which is increasingly turning into a computer on wheels. A number of car manufacturers have... Read more →

Volvo Cars and NVIDIA are partnering on the development of a highly advanced, AI-capable core computer for the next generation of Volvo cars. The core computer is based on NVIDIA’s DRIVE AGX Xavier technology and will allow Volvo Cars to implement an advanced computing platform for its new cars on... Read more →

Autotalks, a developer of V2X (Vehicle to Everything) communication chipsets, and the Israeli startup Griiip, which is developing a next generation single seater race car, have demonstrated the first motorsport Vehicle-to-Vehicle (V2V) application on a racetrack. As part of the demonstration, which took place on 15 March 2018 in a... Read more →

Renesas Electronics Corporation announced the sample shipment of the industry’s first on-chip flash memory microcontroller (MCU) using a 28 nanometer (nm) process technology. To contribute to the realization of next-generation green cars and autonomous vehicles with higher efficiency and higher reliability, the RH850/E2x Series MCU incorporates up to six 400... Read more →

NVIDIA and Continental are partnering to create AI (artificial intelligence) self-driving vehicle systems built on the NVIDIA DRIVE platform, with a planned market introduction starting in 2021 for Level 3 functionality. The partnership will enable the production of AI computer systems that scale from automated Level 2 features through full... Read more →

General Motors has filed a Safety Petition with the US Department of Transportation (USDOT) for GM’s fourth-generation self-driving Cruise AV—the first production-ready vehicle built from the start to operate safely on its own, with no driver, steering wheel, pedals or manual controls. In 2016, GM acquired then-three-year-old start-up Cruise Automation... Read more →

Visteon Corporation unveiled its DriveCore autonomous driving platform at CES 2018. Designed to accelerate the development and commercialization of autonomous driving technology, DriveCore allows automakers to build autonomous driving solutions quickly and in an open collaboration model. Visteon designed DriveCore as a complete technology platform, consisting of the hardware, in-vehicle... Read more →

At CES, Samsung Electronics Co., Ltd. introduced the new Samsung DRVLINE platform—an open, modular, and scalable hardware- and software-based platform for building advanced driver-assistance systems (ADAS). The platform is designed to accommodate a wide range of automated driving requirements, from ADAS and scaling upwards to support full autonomy. DRVLINE hardware... Read more →

NVIDIA is delivering first samples of its Xavier processors (earlier post) to customers this quarter. Xavier, an all-new AI supercomputer designed for use in self-driving cars, is a complete system-on-chip (SoC), integrating a new 512-core Volta GPU, a custom 8-core CPU architecture, and a new computer vision acceleratora, new deep... Read more →

Toyota Research Institute (TRI) will show its next-generation automated driving research vehicle, Platform 3.0, at CES next week in Las Vegas. The new platform, which is built on a Lexus LS 600hL, combines greater technological capabilities with new harmonized styling that integrates the automated vehicle technology into the LS model’s... Read more →

The Volkswagen Group and self-driving technology startup Aurora Innovation, founded by technology veterans from Google, Tesla and Uber, announced a strategic collaboration ahead of the 2018 Consumer Electronics Show (CES) in Las Vegas. The collaboration brings the two companies together to realize self-driving electric vehicles in cities as Mobility-as-a-Service (MaaS)... Read more →

At CES, Continental will showcase a highly flexible computing platform for automated driving systems and the processing of large amounts of data. Developed by Continental’s San Jose Research & Development Center in collaboration with Xilinx, the Assisted & Automated Driving Control Unit will enable Continental’s customers to get to market... Read more →

Renesas Electronics Corporation is introducing the R-Car V3M Starter Kit to simplify and speed up the development of New Car Assessment Program (NCAP) front camera applications, surround view systems, and LiDARs. The new starter kit is based on the R-Car V3M image recognition system-on-chip (SoC), delivering a combination of low... Read more →

Renesas Electronics Corporation and Airbiquity announced a secure, high-performance automotive solution with over-the-air (OTA) capabilities, targeting advanced driver assistance systems (ADAS), vehicle-to-everything (V2X), and automated driving applications of the future. The companies are integrating Airbiquity’s OTAmatic cloud-based OTA software and data management service delivery solution on Renesas’ high-performance, low-power R-Car... Read more →

Renesas Electronics Corporation and Dibotics, a leader in real-time 3D LiDAR processing, have collaborated to develop an automotive-grade embedded solution for LiDAR processing used in advanced driver assistance systems (ADAS) and automated driving applications. The jointly-developed solution will enable system manufacturers to develop real-time 3D mapping systems with high level... Read more →

At the GPU Technology Conference in Munich, NVIDIA unveiled Pegasus, its new NVIDIA DRIVE PX AI computing platform designed to handle Level 5 driverless vehicles. NVIDIA DRIVE PX Pegasus delivers more than 320 trillion operations per second—more than 10x the performance of its predecessor, NVIDIA DRIVE PX 2, which was... Read more →

The GENIVI Alliance, an open, collaborative software development community of automakers and their suppliers, is introducing a Vehicle Domain Interaction Strategy focused on developing open standard interfaces and code that will define the necessary paths bridging multiple car software domains. Announced during its All Member Meeting in Seoul, the new... Read more →

GLOBALFOUNDRIES (GF) plans to introduce a new 12nm Leading-Performance (12LP) FinFET (fin field-effect transistor) semiconductor manufacturing process. The technology is expected to deliver better density and a performance boost over GF’s current-generation 14nm FinFET offering, satisfying the processing needs of the most demanding compute-intensive applications from artificial intelligence and virtual... Read more →

IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips. The details of the process will be presented at the 2017 Symposia on VLSI Technology and Circuits conference in Kyoto, Japan this... Read more →

NVIDIA is collaborating with Toyota to deliver artificial intelligence hardware and software technologies that will enhance the capabilities of autonomous driving systems planned for market introduction within the next few years. Toyota will use the NVIDIA DRIVE PX AI car computer platform (earlier post) to power advanced autonomous driving systems... Read more →

Renesas Electronics Corporation launched Renesas “autonomy”, a new advanced driving assistance systems (ADAS) and automated driving platform. As the first product under the new autonomy platform, Renesas released the R-Car V3M high-performance image recognition system-on-chip (SoC) optimized primarily for use in smart camera applications, as well as surround view systems... Read more →